We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Conductive adhesive.
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Conductive adhesive Product List and Ranking from 11 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

Conductive adhesive Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. ニホンハンダ Tokyo//Electronic Components and Semiconductors
  2. 東洋アルミニウム Osaka//Ferrous/Non-ferrous metals
  3. 太陽金型用品 本社サービスステーション Ibaraki//Trading company/Wholesale
  4. 4 化研テック Osaka//Chemical
  5. 4 ペルノックス Kanagawa//Other manufacturing

Conductive adhesive Product ranking

Last Updated: Aggregation Period:Sep 03, 2025~Sep 30, 2025
This ranking is based on the number of page views on our site.

  1. Conductive Adhesive "ECA Series" ニホンハンダ
  2. Conductive Adhesive TCB Series 東洋アルミニウム
  3. Conductive adhesive (silver paste) TK PASTE series 化研テック
  4. Conductive Adhesive - One-Hand Mixing ペルノックス
  5. 4 Psycholon B (Conductron) 太陽金型用品 本社サービスステーション

Conductive adhesive Product List

1~13 item / All 13 items

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Conductive Adhesive "ECA Series"

Epoxy-based silver paste and nickel paste that cure with low-temperature heating.

The ECA series is a one-component paste-type conductive adhesive. It offers three types, mixed with metal particles "silver," "nickel," and "sintered silver" in epoxy resin. It is suitable for a wide range of fields, including high-reliability devices such as automotive and industrial equipment, consumer electronics, mobile electronic devices, and semiconductor and optical packages. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • glue

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Conductive adhesive (silver paste) TK PASTE series

Our company is developing unique silver pastes (conductive adhesives) by continuously creating various special shapes of "TK silver powder" using our proprietary technology.

TK PASTE is a silver paste/conductive adhesive with the following features: 1. Uses TK silver powder with controllable silver shape and particle size. 2. Achieves various functions such as low resistance, low silver content, and high reliability. 3. Exhibits good continuous dispensing performance with dispensers.

  • glue
  • Other metal materials
  • Other laboratory equipment and containers

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Conductive adhesive [Part number: 81327/81328]

It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles.

"Conductive Adhesive" is a high-quality acrylic emulsion mixed with patented Thunderon Matrix technology conductive adhesive to create a flexible electrical grounding surface under static electricity management floor tiles. It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles. 【Features】 ■ High-quality acrylic emulsion mixed with conductive adhesive ■ Usable for the installation of carpet tiles and vinyl tiles ■ Non-toxic, non-flammable, and water-resistant ■ Covers 4.5m² to 6m² per liter *For more details, please refer to the related link page or feel free to contact us.

  • others

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Conductive Adhesive "AG Series"

It excels in adhesion from various metal and plated surfaces to plastic surfaces!

The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.

  • glue
  • Other consumables

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Conductive Adhesive - One-Hand Mixing

Professional-grade silver-filled conductive adhesive, easy dispensing with one push, cures at room temperature and can be stored at room temperature, suitable for various materials for both printing and bonding, maintains conductivity even when bent, and lasts long after bonding.

◎What is ONE-HAND MIXING! It is a professional-grade conductive adhesive developed by a manufacturer of adhesives that offers a rich lineup for automotive and industrial equipment. Despite being a two-component adhesive, it requires no extra effort for work! Just press to easily weigh, mix, and apply. The narrow outlet allows for dot application and line drawing. ◎It reacts and cures at room temperature, eliminating the need for heating. Moreover, after curing, it achieves a low resistance comparable to solder (around 10^-4 Ω·cm). ◎Despite having a tough coating, it does not crack when bent. Additionally, it remains conductive even when bent. It is highly compatible with various materials such as copper, aluminum, stainless steel, printed circuit boards, ABS, glass, and paper. ◎The cured coating is strong and has good scratch resistance. It is durable against scratches from coins and similar objects, ensuring longevity. Furthermore, it does not dissolve when wiped with solvents. ◎Since the main agent and hardener are separated, there is no need for refrigeration or freezing, allowing for room temperature storage. As a non-hazardous product, it does not require special storage. Additionally, it complies with VOC, REACH, and RoHS regulations, making it environmentally friendly. ◎We can also propose systems that support mass production and automation.

  • Repair Agent
  • Solder
  • glue

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[Research Material] Global Market for Conductive Adhesives

World Market for Conductive Adhesives: Epoxy Adhesives, Silicone Adhesives, Acrylic Adhesives, Others, Automotive Market, Consumer Electronics ...

This research report (Global Electrically Conductive Adhesives Market) investigates and analyzes the current status and outlook for the global market of conductive adhesives over the next five years. It includes information on the overview of the global conductive adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segment by type in the conductive adhesives market includes epoxy adhesives, silicone adhesives, acrylic adhesives, and others, while the segment by application covers the automotive market, consumer electronics, aerospace market, bioscience market, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of conductive adhesives. It also includes the market share of major companies in conductive adhesives, product and business overviews, and sales performance.

  • Other services

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Psycholon B (Conductron)

High conductivity room temperature instant adhesive for discharge machining

It is the first room temperature curing adhesive that functions as a conductive adhesive.

  • glue

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Conductive adhesive (thermosetting conductive adhesive)

High electrical conductivity and excellent thermal conductivity.

Bear Chip is a one-component thermosetting silver-filled epoxy resin developed for implementation and surface mounting. Compatible substrates include LTCC, ceramic substrates, lead frames, polyester films, polyamide films, and PC boards.

  • glue

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Conductive Adhesive TCB Series

Solder alternative for aluminum components! High adhesion and low resistance! Conductive adhesive TCB series.

This is our unique conductive adhesive that uses silver-plated silica filler. [Features] 〇 Good conductivity… It adheres well to various materials and exhibits excellent conductivity. 〇 Excellent migration resistance… By reducing the amount of silver, the risk of migration is minimized. 〇 Lightweight and inexpensive… By using inorganic materials for the core, it is a lightweight material with about one-third the specific gravity compared to silver.

  • Non-ferrous metals

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For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.

[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"

★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.

  • glue

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Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!

Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

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Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!

Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

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