We have compiled a list of manufacturers, distributors, product information, reference prices, and rankings for Conductive adhesive.
ipros is IPROS GMS IPROS One of the largest technical database sites in Japan that collects information on.

Conductive adhesive Product List and Ranking from 10 Manufacturers, Suppliers and Companies

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

Conductive adhesive Manufacturer, Suppliers and Company Rankings

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. ニホンハンダ Tokyo//Electronic Components and Semiconductors
  2. ペルノックス Kanagawa//Other manufacturing
  3. 太陽金型用品 本社サービスステーション Ibaraki//Trading company/Wholesale
  4. 4 化研テック Osaka//Chemical
  5. 4 トーヨーコーポレーション 東京営業部 東京営業3課 Tokyo//Consumer Electronics

Conductive adhesive Product ranking

Last Updated: Aggregation Period:Oct 15, 2025~Nov 11, 2025
This ranking is based on the number of page views on our site.

  1. Conductive Adhesive "ECA Series" ニホンハンダ
  2. Conductive Adhesive - One-Hand MixingⓇ ペルノックス
  3. Conductive adhesive (silver paste) TK PASTE series 化研テック
  4. Psycholon B (Conductron) 太陽金型用品 本社サービスステーション
  5. 4 Conductive Adhesive "AG Series" アンドウ・ディーケイ 藤沢事業所

Conductive adhesive Product List

1~12 item / All 12 items

Displayed results

Conductive Adhesive "ECA Series"

Epoxy-based silver paste and nickel paste that cure with low-temperature heating.

The ECA series is a one-component paste-type conductive adhesive. It offers three types, mixed with metal particles "silver," "nickel," and "sintered silver" in epoxy resin. It is suitable for a wide range of fields, including high-reliability devices such as automotive and industrial equipment, consumer electronics, mobile electronic devices, and semiconductor and optical packages. For product inquiries, please visit our website. http://www.nihonhanda.com For more details about the products, please refer to the information below.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Conductive adhesive (silver paste) TK PASTE series

Our company is developing unique silver pastes (conductive adhesives) by continuously creating various special shapes of "TK silver powder" using our proprietary technology.

TK PASTE is a silver paste/conductive adhesive with the following features: 1. Uses TK silver powder with controllable silver shape and particle size. 2. Achieves various functions such as low resistance, low silver content, and high reliability. 3. Exhibits good continuous dispensing performance with dispensers.

  • glue
  • Other metal materials
  • Other laboratory equipment and containers

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Conductive adhesive [Part number: 81327/81328]

It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles.

"Conductive Adhesive" is a high-quality acrylic emulsion mixed with patented Thunderon Matrix technology conductive adhesive to create a flexible electrical grounding surface under static electricity management floor tiles. It can be used not only for rubber tiles and floor sheets but also for the installation of carpet tiles and vinyl tiles. 【Features】 ■ High-quality acrylic emulsion mixed with conductive adhesive ■ Usable for the installation of carpet tiles and vinyl tiles ■ Non-toxic, non-flammable, and water-resistant ■ Covers 4.5m² to 6m² per liter *For more details, please refer to the related link page or feel free to contact us.

  • others

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Conductive Adhesive "AG Series"

It excels in adhesion from various metal and plated surfaces to plastic surfaces!

The "AG Series" is a conductive adhesive with low electrical resistance and excellent thermal conductivity. By optimizing the shape of the silver filler, it achieves a low resistance of less than 10^-5 Ωcm and a high thermal conductivity of 60 W/Km. Additionally, it excels in adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces, and allows for selection suitable for applications such as low-temperature curing (80°C). 【Features】 ■ Low electrical resistance and excellent thermal conductivity ■ Selection of resins with high adhesion strength available within the series ■ Excellent adhesion from various metal surfaces (gold, silver, aluminum, copper) to plastic surfaces ■ Selection suitable for applications such as low-temperature curing (80°C) *For more details, please refer to the PDF document or feel free to contact us.

  • glue
  • Other consumables

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Conductive Adhesive - One-Hand MixingⓇ

Pro-quality conductive repair, completed with one hand.

■ Easy electrical bonding without soldering Enables secure electrical connections without the need for soldering, making it suitable for users who are not skilled with soldering tools or for environments where heat cannot be applied. ■ Safe for heat-sensitive components and flexible substrates Cures at room temperature, preventing thermal damage to LEDs, plastic parts, FPCs, and other heat-sensitive devices. ■ Strong adhesion with stable, low-resistance conductivity Optimized silver filler formulation provides both excellent conductivity and high adhesive strength, ensuring long-term reliability even under vibration or mechanical stress. ■ Flexible after curing—ideal for bent or vibrating areas Maintains flexibility after curing, enabling use on curved surfaces, moving parts, or areas subject to repeated bending. ■ Suitable for creating or repairing circuit patterns Can be applied to form or repair conductive traces, making it useful for prototyping, R&D, and precision repair work. ■ Automatic mixing with a dedicated nozzle—simple one-handed operation A single push dispenses and mixes both components automatically, eliminating manual ratio control and improving work efficiency. ■ No special storage requirements Can be stored at room temperature—no refrigeration or freezing required—making it convenient for on-site use.

  • Repair Agent
  • Solder
  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Psycholon B (Conductron)

High conductivity room temperature instant adhesive for discharge machining

It is the first room temperature curing adhesive that functions as a conductive adhesive.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Conductive adhesive (thermosetting conductive adhesive)

High electrical conductivity and excellent thermal conductivity.

Bear Chip is a one-component thermosetting silver-filled epoxy resin developed for implementation and surface mounting. Compatible substrates include LTCC, ceramic substrates, lead frames, polyester films, polyamide films, and PC boards.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Development of conductive adhesives, selection of metal nanoparticles and fillers, testing methods, and standards.

Thick film circuits printed with conductive ink! Methods for selecting metal particles used as fillers and surface treatment techniques!

Speaker Part 1: Dr. Takeshi Suga, Engineering PhD, Technical Department, Fujikura Kasei Co., Ltd. Electronic Materials Division Part 2: Masayoshi Yoshitake, Technical Engineer (Metal Division), Research and Development Department, Fukuda Metal Foil Powder Industry Co., Ltd. Part 3: Hiroshi Otsuka, Emeritus Professor, Meisei University Target Audience: Researchers and personnel interested in conductive adhesives, metal nanoparticle fillers, and trends in testing standards. Venue: Kawasaki City Industrial Promotion Hall, Conference Room 1 Date and Time: June 20, 2011 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Please apply early as there may be a rush of applications. Participation Fee: 57,750 yen (tax included, lunch included, including text costs) for up to 2 people from one company. *Tech-Zone members who apply by June 6 will receive an early bird discount price of 52,500 yen (for up to 2 people from one company). ◆ When applying for the early bird discount, please select "1 person (early discount)" or "2 people (early discount)" in the number registration. ◆ Point discounts are not applicable to the early bird discount price. Point discount services can only be applied when applying at the regular price. ◆ For additional applications from the same organization, an additional fee of 23,100 yen per person will be charged.

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

[Research Material] Global Market for Conductive Adhesives

World Market for Conductive Adhesives: Epoxy Adhesives, Silicone Adhesives, Acrylic Adhesives, Others, Automotive Market, Consumer Electronics ...

This research report (Global Electrically Conductive Adhesives Market) investigates and analyzes the current status and outlook for the global market of conductive adhesives over the next five years. It includes information on the overview of the global conductive adhesives market, trends of major companies (sales, selling prices, market share), market size by segment, market size by major regions, and distribution channel analysis. The segment by type in the conductive adhesives market includes epoxy adhesives, silicone adhesives, acrylic adhesives, and others, while the segment by application covers the automotive market, consumer electronics, aerospace market, bioscience market, and others. The regional segments are divided into North America, the United States, Europe, Asia-Pacific, Japan, China, India, South Korea, Southeast Asia, South America, the Middle East, and Africa, to calculate the market size of conductive adhesives. It also includes the market share of major companies in conductive adhesives, product and business overviews, and sales performance.

  • Other services

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Thermal conductivity, self-alignment, repairability, and adhesion improvement of conductive adhesives.

★What are the technical challenges of conductive adhesives that can be used from application to curing!? ★A one-day seminar to understand and master the properties of conductive adhesives!!

Lecturers Part 1: Masahiro Inoue, Assistant Professor, Institute of Industrial Science, Osaka University Part 2: Representative, Research and Development Department, Fukuda Metal Foil & Powder Co., Ltd. Part 3: Representative, Conductive Materials Technology Unit, Technical Development Headquarters, Namics Corporation Target Audience: Engineers and researchers related to implementation technologies such as conductive adhesives and lead-free solder, and those responsible for the development of conductive adhesive-related materials. Venue: Kawasaki International Exchange Center, Kanagawa, Kawasaki Date and Time: January 30, 2012 (Monday) 11:00 AM - 4:00 PM Capacity: 30 people. *Registration will close once full. Please apply early. Participation Fee: [Early Bird Discount Price] For one person from one company, 44,100 yen (tax included, including text costs. For two people, 52,500 yen) ◆ Point discounts from the early bird price do not apply. When using the point discount service, it will only be applicable for applications at the regular price. *However, this applies only to Tech-Zone members who apply by January 16. Membership registration is free. *After January 16, the [Regular Price] will be 47,250 yen for one person from one company (tax included, including text costs. For two people from one company, 55,650 yen).

  • Company:AndTech
  • Price:10,000 yen-100,000 yen
  • Technical Seminar

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

For those struggling with solder connections! A one-component conductive adhesive that can cure at low temperatures.

[Exhibition Participation] No need for reflow or flux cleaning! Reduction of processes and use of materials with low heat resistance is possible. "Plain Set - Conductive Type"

★Are you facing any of these issues? 〇 Unable to apply solder due to the inclusion of heat-sensitive components 〇 Want to mount and join components on flexible substrates 〇 Looking to improve connection reliability between terminals (gold, copper, nickel, tin, etc.) The "Plain Set Conductive Type" is a conductive adhesive that balances conductivity and adhesion based on a low-temperature curing of 80°C. It excels in adhesion and crack resistance, and because it can cure at low temperatures, it can serve as an alternative to solder for electronic components that cannot withstand reflow or high curing temperatures due to heat resistance issues. By not using solder, it eliminates the need for flux cleaning, contributing to a reduction in processes. 【Features】 ■ Cures at a low temperature of 80°C ■ Can replace solder ■ Suppresses the increase in contact resistance with nickel and tin 【Exhibition Information】 Exhibition Name: High-Function Materials Week Adhesive Bonding EXPO Date: October 29 (Tuesday) to 31 (Thursday), 2024, 10:00 AM to 6:00 PM (ends at 5:00 PM on the last day) Venue: Makuhari Messe Booth Number: 15-27 *For more details, please refer to the PDF document or feel free to contact us. Also, please visit our website at the URL below.

  • glue

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration